Publications  ASTM Volume 10.04 - Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies 1.4.2024 preview

ASTM Volume 10.04 - Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies

ASTM Volume 10.04 - Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies

Translate name

PUBLICATION published on 1.4.2024


Language
Format
Availabilityin 10 working days
Price394.00 USD excl. VAT
394.00 USD

Product information:

Designation: ASTM Volume 10.04 - Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies
Approximate weight : 300 g (0.66 lbs)
Publication date: 1.4.2024
Country: American publication
Category: ASTM Section 10 - Electrical Insulation and Electronics

Annotation of standard text:

Volume 10.04 covers standards on electronics, including:
• Innerlayer interconnections and bonding
• Materials and processes for vacuum tubes
• Electronic device characterization
• Hermetic seals
• Hybrid circuits and substrates
• Microelectronic packaging
• Leak testing
• And more
This volume also includes the latest standards relating to:
• Declarable substances in materials
• 3D imaging systems
• Additive manufacturing technologies
ISBN 979-8-88773-073-8

We recommend:

Technical standards updating

Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.

Would you like to know more? Look at this page.




Cookies Cookies

We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.

You can refuse consent here.

Here you can customize your cookie settings according to your preferences.

We need your consent to use the individual data so that you can see information about your interests, among other things.