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Standards ASTM - American technical standards - Page 8702
ASTM – The company, ASTM International, belongs to the largest independent worldwide companies that deal with the development of standards, they are a reliable source of technical standards for materials, products, systems and services. ASTM International standards are known for their high technical quality and market relevancy and that is why they have an important role in the information infrastructure, which conducts projecting, manufacturing and trade in global economy. ASTM publishes standards dealing with metals, combustibility, chemical products, lubricants, fossil fuels, textiles, paints, rubber, piping, forensic sciences, electronics, energetic industry, medical devices and many other subjects.
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ASTM F457-94(1999)
Historical
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Standard Test Method for Speed and Distance Calibration of a Fifth Wheel Equipped With Either Analog or Digital Instrumentation
WITHDRAWN published on 10.9.1999
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ASTM F458-06
Historical
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Standard Practice for Nondestructive Pull Testing of Wire Bonds
WITHDRAWN published on 1.1.2006
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ASTM F458-13
Historical
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Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2
WITHDRAWN published on 1.1.2013
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ASTM F458-13(2018)
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Standard Practice for Nondestructive Pull Testing of Wire Bonds (Withdrawn 2023)
WITHDRAWN published on 1.3.2018
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ASTM F458-84(1995)e1
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Standard Practice for Nondestructive Pull Testing of Wire Bonds (Includes all amendments And changes 3/2/2021).
WITHDRAWN published on 1.1.2001
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ASTM F458-84(2001)
Historical
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Standard Practice for Nondestructive Pull Testing of Wire Bonds
WITHDRAWN published on 1.1.2001
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ASTM F459-06
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
WITHDRAWN published on 1.1.2006
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ASTM F459-13
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
WITHDRAWN published on 1.1.2013
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ASTM F459-13(2018)
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
WITHDRAWN published on 1.3.2018
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ASTM F459-84(1995)e1
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Includes all amendments And changes 8/16/2017).
WITHDRAWN published on 1.1.2001
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