Standards IEC - International electro-technical commission - Page 1036

Event video data recorder for road vehicle accidents - Part 1: Basic requirements
(Enregistreurs de donnees video pour l´identification et l´analyse des causes des accidents des vehicules routiers - Partie 1: Exigences de base)

Standard published on 9.8.2017

Event video data recorder for road vehicle accidents - Part 2: Test methods for evaluating the performance of basic functions
(Enregistreurs de donnees video pour l’identification et l’analyse des causes des accidents des vehicules routiers - Partie 2: Methodes d’essai pour l’evaluation des performances des fonctions de base)

Standard published on 11.12.2019

Wireless power transfer (WPT) - Glossary of terms
(Transfert d´energie sans fil (WPT) - Glossaire des termes)

Standard published on 14.10.2019

Household and similar electrical appliances - Accessibility of control elements, doors, lids, drawers and handles
(Appareils electrodomestiques et analogues - Accessibilite des elements de commande, portes, abattants, tiroirs et poignees)

Standard published on 27.3.2020

Ultrasonics - Physiotherapy systems - Field specifications and methods of measurement in the frequency range 20 kHz to 500 kHz
(Ultrasons – Systemes de physiotherapie – Specifications des champs et methodes de mesure dans la plage de frequences de 20 kHz a 500 kHz)

Standard published on 11.7.2019

Halogen-free thermoplastic insulated and sheathed flexible cables of rated voltages up to and including 300/300 V - Part 1: General requirements and cables

Standard published on 22.11.2017

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
(Circuits integres - Circuits integres tridimensionnels - Partie 1 : Terminologie)

Standard published on 28.11.2018

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
(Circuits integres - Circuits integres tridimensionnels - Partie 2: Alignement de puces empilees a petits pas d´interconnexion)

Standard published on 28.11.2018

Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
(Circuits integres - Circuits integres tridimensionnels - Partie 3: Modele et conditions de mesure des trous de liaison a travers le silicium)

Standard published on 28.11.2018

Insulating liquids - Unused modified or blended esters for electrotechnical applications
(Isolants liquides - Esters neufs modifies ou melanges pour applications electrotechniques)

Standard published on 9.5.2019