ASTM B885-09

Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

STANDARD published on 15.4.2009

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The information about the standard:

Designation standards: ASTM B885-09
Note: WITHDRAWN
Publication date standards: 15.4.2009
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM B885-09 :

Keywords:
contact resistance, contamination, edgecard connector, printed wiring board fingers, Contact resistance, Contamination, Edgecard connector, Electrical contact materials, Foreign matter content, Printed wiring board (PWB) contacts/fingers, Wiring boards, ICS Number Code 31.180 (Printed circuits and boards)