Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
STANDARD published on 1.1.2006
Designation standards: ASTM F584-06
Note: WITHDRAWN
Publication date standards: 1.1.2006
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
bonding wire, inspection, lead-bonding wire, semiconductor packaging, visual inspection, wire, ICS Number Code 29.060.10 (Wires)