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ASTM F641-09(2023)

Standard Specification for Implantable Epoxy Electronic Encapsulants

STANDARD published on 1.1.2023

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The information about the standard:

Designation standards: ASTM F641-09(2023)
Publication date standards: 1.1.2023
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F641-09(2023) :

This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts for implantable epoxy electronic encapsulants. Encapsulants shall be classified depending on contact with tissues or physiological fluids. Chemical composition requirements may include additives, phthalate esters, amines, catalysts, and carbonates. The material shall be tested for the following physical properties: peak exotherm temperature, transparency, foreign particles, USP biological test plastic containers, USP pyrogen test, sterilant residues, cure shrinkage, embedment stress, tissue culture test, long-term immersion test, and accelerated immersion test. The material shall also be inspected with infrared spectroscopy, amine number, epoxide equivalent weight, spectrographic analysis, and total nitrogen.


Keywords:
encapsulants, evaluation of biocompatibility, implantable medical devices,, ICS Number Code 11.040.40 (Implants for surgery, prothetics and orthotics)