ASTM F72-06

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)

STANDARD published on 1.1.2006

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The information about the standard:

Designation standards: ASTM F72-06
Note: WITHDRAWN
Publication date standards: 1.1.2006
The number of pages: 11
Approximate weight : 33 g (0.07 lbs)
Country: American technical standard
Category: Technical standards ASTM

Annotation of standard text ASTM F72-06 :

Keywords:
gold wire, semiconductor, internal, electrical connections, copper-modified wire, beryllium-modified wire, high-strength wire, special purpose wire, lead bonding, thermal stability, high purity gold wire, ICS Number Code 29.060.10 (Wires)