Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly.
STANDARD published on 1.1.2003
Designation standards: DIN EN 61190-1-1:2003-01
Publication date standards: 1.1.2003
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: German technical standard
Category: Technical standards DIN
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage.