DIN EN 61190-1-3:2011-04

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.

STANDARD published on 1.4.2011

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The information about the standard:

Designation standards: DIN EN 61190-1-3:2011-04
Note: WITHDRAWN
Publication date standards: 1.4.2011
The number of pages: 41
Approximate weight : 123 g (0.27 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text DIN EN 61190-1-3:2011-04 :

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten.