E DIN EN 61189-3-719:2014-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling.

STANDARD published on 1.4.2014

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The information about the standard:

Designation standards: E DIN EN 61189-3-719:2014-04
Note: WITHDRAWN
Publication date standards: 1.4.2014
The number of pages: 21
Approximate weight : 63 g (0.14 lbs)
Country: German technical standard
Category: Technical standards DIN

Annotation of standard text E DIN EN 61189-3-719:2014-04 :

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3-719: Prüfverfahren für Verbindungsstrukturen (Leiterplatten) - Prüfung 3E19: Überwachung des Widerstands von Einzeldurchkontaktierungen (PTH - plated-through hole) bei Temperaturwechselbeanspruchung.