IEC 63378-2-1-ed.1.0

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

STANDARD published on 22.10.2024

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The information about the standard:

Designation standards: IEC 63378-2-1-ed.1.0
Publication date standards: 22.10.2024
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC 63378-2-1-ed.1.0 :

IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately. This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.