IEC/TR 62878-2-7-ed.1.0

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

STANDARD published on 20.3.2019

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The information about the standard:

Designation standards: IEC/TR 62878-2-7-ed.1.0
Publication date standards: 20.3.2019
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC/TR 62878-2-7-ed.1.0 :

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.