IEC/TR 63378-1-ed.1.0

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

STANDARD published on 14.12.2021

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The information about the standard:

Designation standards: IEC/TR 63378-1-ed.1.0
Publication date standards: 14.12.2021
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: International technical standard
Category: Technical standards IEC

Annotation of standard text IEC/TR 63378-1-ed.1.0 :

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.