Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
STANDARD published on 16.8.2024
Designation standards: ISO 9455-18:2024
Publication date standards: 16.8.2024
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: International technical standard
Category: Technical standards ISO