ASTM B774-00(2010)

1.1 This specification covers low-melting point metal alloys and solders, including bismuth–tin, bismuth–lead, bismuth–tin–lead, bismuth–tin–lead–cadmium, bismuth–tin–lead–indium–cadmium, bismuth–tin–lead–indium, indium–lead, and indium–lead–silver, and indium–tin joining together two or more metals at temperatures below their melting points; blocking for support and removable borders; radiation shielding; fusible plugs; fuses; tube bending; and punch setting.

1.1.1 This specification shall include those alloys having a liquidus temperature not exceeding 361°F (183°C), the melting point of the tin lead eutectic.

1.1.2 This specification includes low-melting point alloys in the form of solid bars, ingots, powder and special forms, and in the form of solid ribbon and wire.

1.2 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.