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Standard Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique (Withdrawn 2003) (Includes all amendments And changes 8/16/2017).
Automatically translated name:
Standard Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique (Withdrawn 2003)
STANDARD published on 10.12.2000
Designation standards: ASTM F110-00a
Note: WITHDRAWN
Publication date standards: 10.12.2000
SKU: NS-49130
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
angle lapping, diffused layer, epitaxial layer, etching, fringe count, staining, thickness, ICS Number Code 29.045 (Semiconducting materials)
1. Scope |
This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers a procedure suitable for interlaboratory comparisons of layer thickness. This test method is applicable for layers of any resistivity so long as the layer differs from the silicon substrate under it either in conductivity type or in resistivity by at least one order of magnitude. The method described is destructive in nature but is more widely applicable than the alternate infrared method, Test Method F95. 1.2 For layers with thicknesses between 1 and 25 µm, an interlaboratory precision as defined in Practice E177, of +(0.15 T + 0.5 µm) (3S) can be achieved where T represents thickness expressed in micrometres. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. Specific hazard statements are given in Section 8. |
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