ASTM D5138-11
ASTM E986-04(2010)..
ASTM F1711-96(2008)..
ASTM F1844-97(2008)..
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ASTM F1709-97(2008)
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
STANDARD published on 15.6.2008
The information about the standard:
Designation standards: ASTM F1709-97(2008)
Note: WITHDRAWN
Publication date standards: 15.6.2008
SKU: NS-51256
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Category: Technical standards ASTM
The category - similar standards:
Annotation of standard text ASTM F1709-97(2008) :
Keywords:
coating, sputtering, target, thin film, titanium, Electronic materials/applications--specifications, Electronic thin-film applications--specifications, High-purity titanium, Sputtering process/targets--specifications, Thin film applications, Titanium sputtering targets, Titanium (Ti)/alloys--specifications, ICS Number Code 31.120 (Electronic display devices)
Additional information
| 1. Scope | ||
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1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging. 1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance. |
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| 2. Referenced Documents | ||
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