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ASTM F357-78(2002)
Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
STANDARD published on 10.12.2002
The information about the standard:
Designation standards: ASTM F357-78(2002)
Note: WITHDRAWN
Publication date standards: 10.12.2002
SKU: NS-55038
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Category: Technical standards ASTM
Annotation of standard text ASTM F357-78(2002) :
Keywords:
hybrid microcircuits, solderability, solder wetting, thick-film metallization, ICS Number Code 29.050 (Superconductivity and conducting materials)
Additional information
| Significance and Use |
|
The procedure of this practice is suitable for process control. No interlaboratory precision has been established for the procedure of this practice. Therefore, this practice should not be used for the acceptance or rejection of material exchanged between buyers and sellers. |
| 1. Scope |
|
1.1 This practice covers a procedure for determining the solderability of thick-film conductors. The procedure has been adapted from several techniques that are in routine use for testing this property. 1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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