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Standard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding
Automatically translated name:
Standard Specification for Fine Aluminum-1 % Silicon Wire for Semiconductor Lead-Bonding
STANDARD published on 1.1.2013
Designation standards: ASTM F487-13
Note: WITHDRAWN
Publication date standards: 1.1.2013
SKU: NS-55506
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: American technical standard
Category: Technical standards ASTM
Keywords:
silicon aluminum wire, wire bonding, ICS Number Code 29.060.10 (Wires)
1. Scope | ||||||
1.1 This specification covers aluminum–1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 μm (0.003 in.). For diameters larger than 76 μm (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier. 1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only. |
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2. Referenced Documents | ||||||
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Historical
1.10.2009
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15.10.2012
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1.4.2011
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1.11.2008
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1.4.2010
Historical
1.4.2010
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