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Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
STANDARD published on 1.8.2002
Designation standards: ČSN EN 60191-6-1
Classification mark: 358791
Catalog number: 65179
Publication date standards: 1.8.2002
SKU: NS-155827
The number of pages: 4
Approximate weight : 12 g (0.03 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
Semiconductor devices in generalMechanical structures for electronic equipment
Tato část mezinárodní normy IEC 60191 obsahuje požadavky na konstrukční pravidla pro tvary vývodů plastikových pouzder s vývody ve tvaru křídla; např. QFP, SOP, SSOP, TSOP apod., což jsou pouzdra zatříděná jako tvar E v IEC 60191-4. Tato norma je určena k tomu, aby zavedla společná pravidla pro tvary vývodů bez ohledu na typ pouzdra.
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