We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
STANDARD published on 1.2.2002
Designation standards: ČSN EN 60191-6-6
Classification mark: 358791
Catalog number: 63971
Publication date standards: 1.2.2002
SKU: NS-155844
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
Semiconductor devices in generalMechanical structures for electronic equipment
Cílem tohoto konstrukčního návodu je normalizovat obrysy a umožnit vzájemnou zaměnitelnost FLGA pouzder. Rozteč vývodů a obrysy pouzdra těchto pouzder seskupení s malou roztečí jsou menší než u pouzder LGA.
WITHDRAWN
1.1.2000
WITHDRAWN
1.1.2000
WITHDRAWN
1.1.2000
WITHDRAWN
1.1.2000
WITHDRAWN
1.1.2000
WITHDRAWN
1.1.2000
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
Latest update: 2024-12-23 (Number of items: 2 217 157)
© Copyright 2024 NORMSERVIS s.r.o.