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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
Automatically translated name:
Test methods for electrical materials , interconnection structures and assemblies - Part 2-721 : Test methods for materials for interconnection structures - Measurement of relative permittivity and loss factor for copper clad laminates in microwave frequency ( standard for direct use as CSN ).
STANDARD published on 1.12.2015
Designation standards: ČSN EN 61189-2-721
Classification mark: 359039
Catalog number: 98353
Publication date standards: 1.12.2015
SKU: NS-621633
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
This part of IEC 61189 outlines a way to determine the relative permittivity ( r) and loss tangent (tan ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials
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