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Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Automatically translated name:
Surface Mount Technology - Part 4: Classification, packaging , labeling and handling of components sensitive to moisture ( standard for direct use as CSN ).
STANDARD published on 1.12.2015
Designation standards: ČSN EN 61760-4
Classification mark: 359310
Catalog number: 98354
Publication date standards: 1.12.2015
SKU: NS-621637
The number of pages: 44
Approximate weight : 132 g (0.29 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.
This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.
This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to
" semiconductor devices,
" devices for flow (wave) soldering
Technologie povrchové montáže - Část 4: Klasifikace, balení, značení a manipulace se součástkami citlivými na vlhkost (Norma k přímému použití jako ČSN).
Change published on 1.10.2018
Selected format:Latest update: 2024-12-21 (Number of items: 2 216 840)
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