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ČSN EN IEC 61189-2-808 (359039)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
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STANDARD published on 1.10.2024
The information about the standard:
Designation standards: ČSN EN IEC 61189-2-808
Classification mark: 359039
Catalog number: 520035
Publication date standards: 1.10.2024
SKU: NS-1198935
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
The category - similar standards:
Annotation of standard text ČSN EN IEC 61189-2-808 (359039):
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE - This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A
Preview of the standard ČSN EN IEC 61189-2-808 (359039)
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