ČSN EN IEC 61189-5-501 (359039)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

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STANDARD published on 1.8.2021


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The information about the standard:

Designation standards: ČSN EN IEC 61189-5-501
Classification mark: 359039
Catalog number: 512553
Publication date standards: 1.8.2021
SKU: NS-1030519
The number of pages: 28
Approximate weight : 84 g (0.19 lbs)
Country: Czech technical standard
Category: Technical standards ČSN

The category - similar standards:

Printed circuits and boards

Annotation of standard text ČSN EN IEC 61189-5-501 (359039):

This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long parallel electrodes on an IPC B53 standardized test coupon are used for the evaluation. Coupons are conditioned and measurements taken at a high temperature and humidity. The electrodes are electrically biased during conditioning to facilitate electrochemical reactions, as shown in Figure 1 and Figure 3. Reference can be made to IEC TR 61189-5-506, which examines different geometry comb patterns: 400 m x 500 m; 400 m x 200 m; and 318 m x 318 m. Figure 1 - SIR pattern Specifically, this method is designed to simultaneously assess: - leakage current caused by ionized water films and electrochemical degradation of test vehicle, (corrosion, dendritic growth); - provide metrics that can appropriately be used for binary classification (e.g. go/no go; pass/fail); - compare, rank or characterize materials and processes. This test is carried out at high humidity and heat conditions

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