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Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Translate name
STANDARD published on 1.7.2024
Designation standards: ČSN EN ISO 9455-17
Classification mark: 050067
Catalog number: 519239
Publication date standards: 1.7.2024
SKU: NS-1188570
The number of pages: 36
Approximate weight : 108 g (0.24 lbs)
Country: Czech technical standard
Category: Technical standards ČSN
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and leaf-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer
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Latest update: 2024-07-26 (Number of items: 2 339 085)
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