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Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).
STANDARD published on 1.3.2011
Designation standards: DIN EN 60191-6-21:2011-03
Publication date standards: 1.3.2011
SKU: NS-236840
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: German technical standard
Category: Technical standards DIN
Electrical and electronics engineering drawingsMechanical structures for electronic equipment
Mechanische Normung von Halbleiterbauelementen - Teil 6-21: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP).
1.9.2002
1.3.2011
1.8.2013
1.6.2001
1.1.2004
WITHDRAWN
1.1.2010
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