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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity).
STANDARD published on 1.7.2004
Designation standards: DIN EN 60749-14:2004-07
Publication date standards: 1.7.2004
SKU: NS-237796
The number of pages: 19
Approximate weight : 57 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse).
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1.4.2003
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1.6.2011
1.9.2003
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