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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength.
STANDARD published on 1.12.2003
Designation standards: DIN EN 60749-22:2003-12
Publication date standards: 1.12.2003
SKU: NS-237810
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard
Category: Technical standards DIN
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit (Bond-Strength).
1.8.1997
1.4.1992
1.8.2012
1.12.2003
WITHDRAWN
1.4.2003
1.4.2003
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