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Standard DIN EN 62047-18:2014-04 1.4.2014 preview

DIN EN 62047-18:2014-04

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials.



STANDARD published on 1.4.2014


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The information about the standard:

Designation standards: DIN EN 62047-18:2014-04
Publication date standards: 1.4.2014
SKU: NS-239566
The number of pages: 15
Approximate weight : 45 g (0.10 lbs)
Country: German technical standard
Category: Technical standards DIN

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The category - similar standards:

Semiconductor devices in generalElectromechanical components in general

Annotation of standard text DIN EN 62047-18:2014-04 :

Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 18: Biegeprüfverfahren für Dünnschichtwerkstoffe.

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Latest update: 2024-09-25 (Number of items: 2 350 354)
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