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Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD).
Translate name
STANDARD published on 1.3.2023
Designation standards: DIN EN IEC 61188-6-2:2023-03
Publication date standards: 1.3.2023
SKU: NS-1102725
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: German technical standard
Category: Technical standards DIN
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-2: Anschlussflächen – Beschreibung der Anschlussflächen für die meisten oberflächenmontierbaren Bauelemente (SMD, en: surface mounted components).
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