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Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste.
STANDARD published on 1.7.2013
Designation standards: E DIN EN 61189-5-3:2013-07
Note: WITHDRAWN
Publication date standards: 1.7.2013
SKU: NS-292121
The number of pages: 69
Approximate weight : 207 g (0.46 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-3: Prüfverfahren für bestückte Leiterplatten: Lotpaste.
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