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Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods.
STANDARD published on 1.11.2012
Designation standards: E DIN EN 62047-16:2012-11
Note: WITHDRAWN
Publication date standards: 1.11.2012
SKU: NS-292591
The number of pages: 18
Approximate weight : 54 g (0.12 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 16: Messverfahren zur Ermittlung der Eigenspannungen in Dünnschichten von MEMS-Bauteilen - Substratkrümmungs- und Biegebalken-Verfahren.
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