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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method.
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STANDARD published on 1.3.2022
Designation standards: E DIN EN IEC 61189-2-808:2022-03
Publication date standards: 1.3.2022
SKU: NS-1049849
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode.
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