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Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity.
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STANDARD published on 1.11.2020
Designation standards: E DIN EN IEC 62878-2-602:2020-11
Note: WITHDRAWN
Publication date standards: 1.11.2020
SKU: NS-1005605
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: German technical standard (Draft)
Category: Technical standards DIN
Montageverfahren für eingebettete Bauteile - Teil 2-602: Leitfaden für gestapelte Elektronikmodule - Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen.
Latest update: 2024-09-25 (Number of items: 2 350 354)
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