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IEC 60068-2-58-ed.4.0
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
STANDARD published on 27.3.2015
The information about the standard:
Designation standards: IEC 60068-2-58-ed.4.0
Publication date standards: 27.3.2015
SKU: NS-583710
The number of pages: 75
Approximate weight : 225 g (0.50 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60068-2-58-ed.4.0 :
IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. This edition includes the following significant technical changes with respect to the previous edition: - the addition of Sn-Bi low temperature solder alloy; - the addition of several reflow test conditions in Table 7 - Resistance to soldering heat - Test conditions and severity, reflow method; - introduction of reflow test method for Test Td3: Dewetting and resistance to dissolution of metallization; - implementation of guidance for the choice of a test severity in Clause B.3. LIEC 60068-2-58:2015 decrit lessai Td applicable aux composants pour montage en surface (CMS). La presente norme fournit des procedures pour determiner la brasabilite et la resistance a la chaleur de brasage des composants dans les applications qui utilisent des alliages de brasure, qui sont des alliages etain-plomb eutectiques ou quasi eutectiques (Pb), ou des alliages sans plomb. Les procedures utilisent soit une methode du bain de brasage, soit une methode de brasage par fusion, et sont applicables uniquement aux eprouvettes ou produits concus pour resister a une immersion de courte duree dans une brasure fondue ou a une exposition limitee aux systemes de brasage par fusion. Cette edition inclut les modifications techniques majeures suivantes par rapport a ledition precedente: - ajout dun alliage de brasure Sn-Bi a faible temperature; - ajout de plusieurs conditions dessai de brasage par fusion dans le Tableau 7 - Resistance a la chaleur de brasage - Conditions dessai et severite, methode de brasage par fusion; - introduction dune methode dessai de brasage par fusion pour lessai Td3: Demouillage et resistance de la metallisation a la dissolution; - application de lignes directrices pour le choix de la severite dessai a larticle B.3.
These changes apply to this standard:
IEC 60068-2-58-ed.4.0/Amd.1
Change
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Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
(Amendement 1 - Essais d’environnement - Partie 2-58: Essais - Essai Td: Methodes d’essai de la soudabilite, resistance de la metallisation a la dissolution et resistance a la chaleur de brasage des composants pour montage en surface (CMS))
Change published on 28.7.2017
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