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IEC 60068-2-83-ed.1.0
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
STANDARD published on 7.9.2011
The information about the standard:
Designation standards: IEC 60068-2-83-ed.1.0
Publication date standards: 7.9.2011
SKU: NS-408684
The number of pages: 76
Approximate weight : 228 g (0.50 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60068-2-83-ed.1.0 :
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method. La CEI 60068-2-83:2011 fournit des methodes denquetes comparatives sur la mouillabilite des sorties metalliques ou metallisees des composants pour montage en surface (CMS) avec des pates a braser. Ces methodes ne servent pas a fournir des donnees quantitatives absolues utilisees dans le cadre dacceptions ou de rejets. NOTE: Differentes methodes dessai de brasabilite des composants pour montage en surface (CMS) sont decrites dans la CEI 60068-2-58 et dans la CEI 60068-2-69. La CEI 60068-2-58 prescrit une evaluation visuelle utilisant un bain de brasage et la methode de refusion, la CEI 60068-2-69 prescrit une evaluation de balance de mouillage utilisant la methode du bain de brasage et des gouttelettes de brasure.
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