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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
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STANDARD published on 23.1.2018
Designation standards: IEC 60191-1-ed.3.0
Publication date standards: 23.1.2018
SKU: NS-806654
The number of pages: 36
Approximate weight : 108 g (0.24 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60191-1:2018 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to the previous edition: a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8; b) a definition of the term "stand-off" has been added; c) the methods for locating the datum have been extended to be suitable for SMD-packages; d) the visual identification of terminal position one for automatic handling has been clarified; e) the rules for the drawing of terminals have been clarified; f) Table A.1 has been completed with symbols specifically for SMD-packages; g) Annex B "Standardization philosophy" has been deleted; h) a normative Annex with special rules for SMD-packages has been added; i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages. L’IEC 60191-1:2018 donne des lignes directrices pour la preparation des dessins d’encombrement des dispositifs discrets, comprenant les dispositifs discrets a semiconducteurs pour montage en surface dont le nombre de connexions est inferieur a 8. Il convient egalement de se referer a l’IEC 60191-6 pour la preparation des dessins d’encombrement des dispositifs discrets pour montage en surface dont le nombre de connexions est superieur ou egal a 8. L’objectif principal de ces dessins consiste a indiquer l’espace a octroyer aux dispositifs dans un equipement, ainsi que d’autres caracteristiques dimensionnelles exigees pour assurer une interchangeabilite mecanique. Cette edition inclut les modifications techniques majeures suivantes par rapport a l’edition precedente:
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