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IEC 60191-6-12-ed.2.0
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
STANDARD published on 8.6.2011
The information about the standard:
Designation standards: IEC 60191-6-12-ed.2.0
Publication date standards: 8.6.2011
SKU: NS-409101
The number of pages: 37
Approximate weight : 111 g (0.24 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-12-ed.2.0 :
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised. La CEI 60191-6-12:2011 fournit les dessins dencombrement, les dimensions, et les variations recommandees, normalises pour tous les boitiers matriciels a plots et a pas fins (FLGA: Fine-Pitch Ball Grid Array Package) comportant des pas de bornes inferieurs ou egaux a 0,8 mm. La presente edition inclut les modifications significatives suivantes par rapport a ledition anterieure: - le domaine dapplication est etendu afin que la presente norme couvre aussi les FLGA de type carre. Le titre de la norme a ete modifie en consequence. "Type rectangulaire" a ete supprime du titre; - le pas de bille de 0,3 mm a ete ajoute; - la reference passe de "reference du corps" a "reference de la bille"; - les listes de combinaison de D, E, MD, et ME ont ete revisees.
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