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Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
STANDARD published on 18.10.2002
Designation standards: IEC 60191-6-2-ed.1.0/Cor.1
Note: Correction
Publication date standards: 18.10.2002
SKU: NS-409109
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Category: Technical standards IEC
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-2: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs pour montage en surface - Guide de conception pour les boitiers a broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm)
Standard published on 11.12.2001
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