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IEC 60191-6-22-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
STANDARD published on 11.12.2012
The information about the standard:
Designation standards: IEC 60191-6-22-ed.1.0
Publication date standards: 11.12.2012
SKU: NS-409113
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-22-ed.1.0 :
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA). La CEI 60191-6-22:2012 fournit les dessins dencombrement et les dimensions associees, communs aux structures et materiaux des boitiers en silicium des boitiers matriciels a billes (BGA, ball grid array) et des boitiers matriciels a zone de contact plate (LGA, land grid array).
Similar standards:
30.9.1999
16.6.2000
29.9.2000
29.10.1999
30.10.2001
19.11.2003
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