We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
STANDARD published on 29.9.2000
Designation standards: IEC 60191-6-3-ed.1.0
Publication date standards: 29.9.2000
SKU: NS-409114
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E. La CEI 60191-6-3:2000 stipule une methode de mesure des dimensions des boitiers plats quadrangulaires (QFP) qui sont classes dans la forme E.
Latest update: 2024-09-12 (Number of items: 2 346 316)
© Copyright 2024 NORMSERVIS s.r.o.