Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 60191-6-4-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
STANDARD published on 11.6.2003
The information about the standard:
Designation standards: IEC 60191-6-4-ed.1.0
Publication date standards: 11.6.2003
SKU: NS-409115
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-4-ed.1.0 :
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. La CEI 60191-6-4:2003 couvre les exigences relatives aux methodes de mesure des dimensions des boitiers matriciels a billes (BGA).
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
