Cookies
We need your consent to use the individual data so that you can see information about your interests, among other things. Click "OK" to give your consent.
IEC 60191-6-8-ed.1.0
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
STANDARD published on 27.8.2001
The information about the standard:
Designation standards: IEC 60191-6-8-ed.1.0
Publication date standards: 27.8.2001
SKU: NS-409118
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 60191-6-8-ed.1.0 :
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP. La CEI 60191-6-8:2001 fournit les dessins dencombrement et les dimensions courants de tous les types de structures et de materiaux composes de boitiers plats quadrangulaires en ceramique, scellement verre (appeles ci-apres G-QFP). Lobjectif du present guide de conception est de normaliser les encombrements et dobtenir linterchangeabilite des G-QFP.
We recommend:
Technical standards updating
Do you want to make sure you use only the valid technical standards?
We can offer you a solution which will provide you a monthly overview concerning the updating of standards which you use.
Would you like to know more? Look at this page.
