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Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
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STANDARD published on 15.11.2022
Designation standards: IEC 60286-3-ed.7.0
Publication date standards: 15.11.2022
SKU: NS-1093328
The number of pages: 113
Approximate weight : 370 g (0.82 lbs)
Country: International technical standard
Category: Technical standards IEC
Electronic components in generalMechanical structures for electronic equipment
IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
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Latest update: 2024-09-15 (Number of items: 2 433 670)
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