Standard IEC 61189-2-809-ed.1.0 9.12.2024 preview

IEC 61189-2-809-ed.1.0

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

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STANDARD published on 9.12.2024


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The information about the standard:

Designation standards: IEC 61189-2-809-ed.1.0
Publication date standards: 9.12.2024
SKU: NS-1207657
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Printed circuits and boards

Annotation of standard text IEC 61189-2-809-ed.1.0 :

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur. L’IEC 61189-2-809:2024 definit la methode a suivre en vue de determiner le coefficient de dilatation thermique (CTE, coefficient of thermal expansion) X/Y des materiaux isolants electriques a laide dun analyseur thermomecanique (TMA, thermomechanical analyser). La presente methode est applicable aux materiaux qui sont solides dans toute la plage de temperatures utilisee, et qui conservent une durete et une rigidite suffisantes sur la plage de temperatures, de telle sorte quune indentation irreversible de leprouvette par la sonde de detection ne se produise pas.

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