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IEC 62047-13-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
STANDARD published on 28.2.2012
The information about the standard:
Designation standards: IEC 62047-13-ed.1.0
Publication date standards: 28.2.2012
SKU: NS-414101
The number of pages: 30
Approximate weight : 90 g (0.20 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-13-ed.1.0 :
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 µm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized. La CEI 62047-13:2012 specifie la methode dessai dadherence entre des elements microminiaturises et un substrat au moyen deprouvettes de forme en colonnes. La presente norme internationale peut etre appliquee a la mesure de la resistance dadherence des microstructures, preparees sur un substrat, dont la largeur et lepaisseur sont de 1 µm a 1 mm, respectivement. La presente norme specifie la methode dessai dadherence pour les elements microminiaturises, en vue dune selection optimale des materiaux et des conditions de traitement pour les dispositifs MEMS. La presente norme ne presente pas de restrictions particulieres relatives au materiau des eprouvettes dessai, a la taille de ces dernieres, ni a la performance du dispositif de mesure, etant donne que les materiaux et la taille des composants des dispositifs MEMS comportent une large gamme et que les machines dessais pour les materiaux microminiaturises nont pas ete generalisees.
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