Standard IEC 62047-14-ed.1.0 28.2.2012 preview

IEC 62047-14-ed.1.0

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials



STANDARD published on 28.2.2012


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The information about the standard:

Designation standards: IEC 62047-14-ed.1.0
Publication date standards: 28.2.2012
SKU: NS-414102
The number of pages: 34
Approximate weight : 102 g (0.22 lbs)
Country: International technical standard
Category: Technical standards IEC

The category - similar standards:

Other semiconductor devices

Annotation of standard text IEC 62047-14-ed.1.0 :

IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 µm to 300 µm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process. La CEI 62047-14:2012 fournit les definitions et decrit les procedures de mesure de la limite de formage des materiaux a couche metallique dune epaisseur comprise entre 0,5 µm et 300 µm. Les materiaux a couche metallique decrits ci-apres sont generalement utilises dans les composants electriques, les MEMS et les microdispositifs. Lorsque des materiaux a couche metallique utilises dans les composants MEMS (voir le 2.1.2 de la CEI 62047-1:2005) sont fabriques par un procede de formage tel que lempreinte, il est necessaire de prevoir la defaillance des materiaux afin daccroitre la fiabilite des composants. Par le biais de cette prevision, lefficacite de fabrication des composants MEMS par le procede de formage peut egalement etre amelioree, car la periode delaboration dun produit donne peut etre reduite et le cout de fabrication peut ainsi en etre diminue. La presente norme presente lune des methodes de prevision concernant la defaillance de materiaux lors du procede dempreinte.

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