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IEC 62047-18-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
STANDARD published on 17.7.2013
The information about the standard:
Designation standards: IEC 62047-18-ed.1.0
Publication date standards: 17.7.2013
SKU: NS-414103
The number of pages: 26
Approximate weight : 78 g (0.17 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-18-ed.1.0 :
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features. La CEI 62047-18:2013 specifie la methode dessai de flexion des materiaux en couche mince de longueur et largeur inferieures a 1 mm et depaisseur comprise entre 0,1 micrometre et 10 micrometre. La presente Norme Internationale specifie les essais de flexion et la forme des eprouvettes dessai pour des eprouvettes dessai de type en porte-a-faux lisses microminiaturises, qui garantissent une precision correspondant aux caracteristiques speciales.
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