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IEC 62047-22-ed.1.0
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
STANDARD published on 19.6.2014
The information about the standard:
Designation standards: IEC 62047-22-ed.1.0
Publication date standards: 19.6.2014
SKU: NS-414108
The number of pages: 20
Approximate weight : 60 g (0.13 lbs)
Country: International technical standard
Category: Technical standards IEC
The category - similar standards:
Annotation of standard text IEC 62047-22-ed.1.0 :
IEC 62047-22:2014 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other. LIEC 62047-22:2014 specifie une methode dessai de traction en vue de mesurer les proprietes electromecaniques des materiaux des systemes microelectromecaniques (MEMS, Micro-Electromechanical Systems) de couches minces conductrices colles sur des substrats souples non conducteurs. Les structures en couches minces sur des substrats souples sont largement utilisees dans les MEMS, les produits grand public, et les electroniques montes sur support souple. Le comportement electrique des couches sur substrats souples differe de celui des couches et substrats independants du fait des interactions liees aux interfaces. Differentes combinaisons de substrats souples et de couches minces influent souvent de diverses manieres sur les resultats dessai en fonction des conditions dessais et de ladherence liee aux interfaces. Lepaisseur souhaitee dun materiau MEMS mince est 50 fois plus mince que celle dun substrat souple, alors que dautres dimensions sont similaires les unes aux autres.
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